发明名称 |
Inspection of solder bump lighted with rays of light intersecting at predetermined angle |
摘要 |
A bump inspecting apparatus lights a spherical solder bump mounted on the surface of a circuit board and has a reinforcing resin applied to the lower half thereof from all circumferential directions with rays of light which intersect at a predetermined angle. An image of the lighted solder bump is captured while the amount of light irradiated upon the central portion of a solder bump is reduced. An object is extracted from image data obtained by the image capture and the area and/or the aspect ratio of the object are confirmed. The quality of the state of the reinforcing resin applied to the solder bump can be inspected.
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申请公布号 |
US6608921(B1) |
申请公布日期 |
2003.08.19 |
申请号 |
US19990378035 |
申请日期 |
1999.08.20 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
INOUE MASAHIKO;IKEDA HIROSHI |
分类号 |
G01B11/24;G01N21/956;G01R31/04;G01R31/309;G06T7/00;H05K3/34;(IPC1-7):G06K9/00 |
主分类号 |
G01B11/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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