发明名称 Method for extending a laser annealing pulse
摘要 A method for an efficient extended pulse laser annealing process is provided. The method comprises: supplying a substrate with a thickness; selecting an energy density; selecting an extended pulse duration; laser annealing a substrate region; in response to cooling the substrate region, crystallizing the substrate region; and, efficiently extending the lateral growth of crystals in the substrate region. When the substrate has a thickness of approximately 300 Å, the energy density is selected to be in the range of 400 to 500 millijoules pre square centimeter (mJ/cm2). The pulse duration is selected to be in the range between 70 and 120 nanoseconds (ns). More preferably, the pulse duration is selected to be in the range between 90 and 120 ns. Most preferable, the pulse duration is approximately 100 ns. Then, efficiently extending the lateral growth of crystals in the substrate region includes laterally growing crystals at a rate of approximately 0.029 microns per nanosecond. Processes for 500 Å and 1000 Å substrates are also provided.
申请公布号 US6607971(B1) 申请公布日期 2003.08.19
申请号 US20020136676 申请日期 2002.04.30
申请人 SHARP LABORATORIES OF AMERICA, INC. 发明人 MORIGUCHI MASAO;VOUTSAS APOSTOLOS T.;MITANI YASUHIRO
分类号 H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L21/20;H01L21/00 主分类号 H01L21/20
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