发明名称 |
Dielectric material including particulate filler |
摘要 |
A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from -55 to 125° C.
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申请公布号 |
US6608760(B2) |
申请公布日期 |
2003.08.19 |
申请号 |
US19990458363 |
申请日期 |
1999.12.09 |
申请人 |
TPL, INC. |
发明人 |
HARTMAN WILLIAM F.;SLENES KIRK M.;LAW KRISTEN J. |
分类号 |
B32B27/00;H04L29/06;H05K1/16;H05K3/46;(IPC1-7):H05K1/16 |
主分类号 |
B32B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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