| 摘要 |
PURPOSE: Sputtering equipment for manufacturing a semiconductor device is provided to be capable of preventing the generation of etching process error and easily connecting a sleeve and a driving shaft by improving the structure of the sleeve. CONSTITUTION: Sputtering equipment is provided with a table(1) installed for loading a wafer(W), a driving shaft(11) capable of being moved up and down, installed and connected to the center portion of the table, and a sleeve(50) installed between the table and the driving shaft for conserving the leveling state of the table. The sleeve includes a cylindrical body(51) for inserting the driving shaft, a flange part(53) formed at one end of the cylindrical body for connecting a fixing part(13), a driving shaft fixing part(55), and a cantilever part(57) horizontally prolonged from the other end of the cylindrical body for supporting the table. At this time, the cylindrical body, the flange part, the driving shaft fixing part, and the cantilever part are formed as one piece.
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