| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate treating device and process which can improve cooling efficiency and increase the throughput capacity. <P>SOLUTION: A reactor 1 is equipped with a reaction part 1a for subjecting a treating substrate S to gas phase reaction and, beneath this, a carry-in-and-out part 1b where a substrate-supporting means 6 is positioned upon carrying the substrate in and out by a conveying robot 10. The device is equipped with a first elevating means for moving the substrate-supporting means 6 up and down between the reaction part 1a and the carrying-in-and-out part 1b, a second elevating means for moving a lower gas-feeding means 11 up and down and sending it down along with the descending substrate-supporting means 6 for carrying out the substrate S after reaction, and a descending distance-controlling means for spraying a cooling gas to the substrate S and the substrate-supporting means 6 through the lower gas-feeding means 11 upon cooling after reaction and sending down the lower gas-feeding means 11 and the substrate-supporting means 6 while individually controlling their descending distances. <P>COPYRIGHT: (C)2003,JPO</p> |
