发明名称 METHOD FOR MANUFACTURING ELECTRONIC PARTS, AND ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To secure a satisfactory adhesion between a metallic oxide and a conductive film, and to improve resonance characteristics by reducing the conductor loss. SOLUTION: This manufacturing method comprises (a) making a ceramic workpiece 1 with a flat surface, (b) preparing a Zn solution which contains ions of amphoteric metals having electrochemically less noble potential than the redox potential of Zn, for instance, like Al<SP>3+</SP>or Si<SP>4+</SP>, and forming a Zn film 2 on the surface of the ceramic workpiece 1 by immersing it in the Zn solution, and then (c) forming a plating film 3 on the Zn film 2 by electroless plating. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003231972(A) 申请公布日期 2003.08.19
申请号 JP20020035376 申请日期 2002.02.13
申请人 MURATA MFG CO LTD 发明人 YOSHIDA IKUSHI
分类号 C23C18/18;H01P1/205;H01P7/04;H01P11/00;(IPC1-7):C23C18/18 主分类号 C23C18/18
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