ADHESIVE FILM, SEMICONDUCTOR PACKAGE USING THE SAME AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film having flux activity and increasing workability in bonding, and to provide a semiconductor package and a semicon ductor device each using the adhesive film. SOLUTION: This adhesive film is applicable to mounting a semiconductor element or a semiconductor device and is characterized by comprising a first resin having one or more phenolic hydroxy, a second resin working as an antioxidant and curable, a third resin and a forth resin having lower weight-average molecular weight than that of the third resin. The semiconductor package is characterized in that the semiconductor element and an interposer are mounted with the adhesive film. The semiconductor device is characterized by that the semiconductor package and a printed circuit board are mounted with the adhesive sheet. COPYRIGHT: (C)2003,JPO