发明名称 POLYPHENYLENE SULFIDE RESIN COMPOSITION WITH HIGH HEAT DISSIPATION FOR PRECISION MOLDING USE
摘要 PROBLEM TO BE SOLVED: To provide an optical parts precision molding compound consisting of a polyphenylene sulfide resin composition having good molding processability such as injection molding and also having high heat dissipation. SOLUTION: This polyphenylene sulfide resin composition for optical parts precision molding use is obtained by incorporating (a) 100 pts.wt. of a polyphenylene sulfide resin with (b) 50-300 pts.wt. of graphite 1-300μm in mean particle size and (c) 20-300 pts.wt. of another inorganic filler, with the proviso that the total amount of components (b) and (c) is≤400 pts.wt. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003231811(A) 申请公布日期 2003.08.19
申请号 JP20020032930 申请日期 2002.02.08
申请人 SUMITOMO BAKELITE CO LTD 发明人 TSURUSAKI MUNEO
分类号 G02B1/04;C08K3/00;C08K3/04;C08L81/02;(IPC1-7):C08L81/02 主分类号 G02B1/04
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