| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel and excellent polishing device in which a polishing burn is prevent surely from occurring on the surface being polished of a work having machining strain, e.g. the polished rear surface of a semiconductor wafer 24. <P>SOLUTION: A cooling means 113 for supplying cooling liquid is disposed at least in the central region on the rear surface of a chuck plate 98. <P>COPYRIGHT: (C)2003,JPO |
