| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of mounting an IC chip on a web material, and also to provide a package with IC chips and a method of manufacturing the same. <P>SOLUTION: The method of mounting an IC chip on the web material comprises processes of (1) forming recessed holes corresponding to an outer shape and a depth of the IC chip in the web material at intervals while the web material is traveling, (2) passing the web material through a fluid scattered with IC chips to leave a single IC chip in each hole, with the IC chip being engaged with the hole, (3) removing unnecessary IC chips, and (4) covering the entire surface of the web material including the hole sections with a sealant film. The package with IC chips is such that an antenna pattern is printed on a basic material film by conductive ink, and the IC chips 2 are set in the holes disposed at positions of antenna terminals, and the entire surface is covered with the sealant film 3. <P>COPYRIGHT: (C)2003,JPO |
