发明名称 METHOD OF MANUFACTURING COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing method of a cooling device which efficiently transmits heat to solder and can perform satisfactory soldering. SOLUTION: In the manufacturing method of the cooling device having a heating element (12) and a radiator (14) moving and radiating heat generated from the heating element (12), the radiator (14) has a heat transmission tube (16) whose inner part is hollow. The flat heating face of a main heater (29) is thermally brought into contact with one side of the heating element (12) constituted of a thermoelectric module (26) having thermoelectric elements (19 and 20). The radiator (14) is brought into contact with the other side of the heating element (12) through a bonding material (25). The cooling device (11) is disposed inside a vacuum furnace (27), the temperature of the main heater (29) is raised and the bonding material (25) is dissolved. The heating element (12) and the radiator are bonded and working fluid is filled into the heat transmission tube part (16). COPYRIGHT: (C)2003,JPO
申请公布号 JP2003229520(A) 申请公布日期 2003.08.15
申请号 JP20020027359 申请日期 2002.02.04
申请人 KOMATSU LTD 发明人 ONISHI TETSUO;OKUBO HIDEAKI;TACHIBANA HIDEAKI;SUGIHARA TAKUMI
分类号 F25B21/02;F28D15/02;H01L23/36;H01L23/38;H01L23/473;(IPC1-7):H01L23/36 主分类号 F25B21/02
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