| 摘要 |
PROBLEM TO BE SOLVED: To facilitate exfoliation and elimination of resist for a pad window aperture without causing ununiformity which becomes cause of image pickup irregularity on a surface of an on-chip microlens, and maintain mechanical strength of wire bonding by preventing reduction of film thickness of an aluminum electrode of a pad part. SOLUTION: After the on-chip microlens 22 is formed, a part of the on-chip microlens 22 which part corresponds to the pad part 14 is eliminated, a pad window 28 is formed, and a surface of the on-chip microlens is made uniform. By using plasma dry etching treatment which uses only oxygen gas, production of a cured film of the resist 24 for the pad window aperture is reduced. Further, reduction of film thickness of the aluminum electrode of the pad part 14 is prevented. COPYRIGHT: (C)2003,JPO
|
