| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA part where positioning in mounting it to a wiring board and the precision of mounting height are improved, and to provide the mounting method of the BGA part and a semiconductor device. SOLUTION: The BGA part 1 is constituted of a main body 3 mounting electronic parts, multiple electrode pads 4 arranged at the backside of the main body 3 and connection solder balls 5 disposed on the electrode pads 4. At the backside of the main body 3, the BGA part 1 is inserted into through holes 6 formed in the wiring board 2 on which the BGA part 1 is mounted, and positioning terminals 7 formed of materials which do not melt at the melting temperature of a solder are arranged. The positioning terminals 7 are constituted of engagement parts 7a engaged into the through holes 6 and support parts 7b whose diameters are larger than the engagement parts 7a and which substantially have lengths by desired mounting heights. COPYRIGHT: (C)2003,JPO
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