| 摘要 |
PROBLEM TO BE SOLVED: To uniformly scatter powder for preventing the fusion of semiconductor wafers onto the semiconductor wafers. SOLUTION: When pressurized gas is supplied into a container (6) for accommodating a powdered matter (7) to covey the powdered matter (7) into a housing (5) from the container (6), and the powdered matter (7) is scattered onto a plurality of semiconductor wafers (1) that are arranged in the housing (5), the container (6) is heated for drying the powdered matter (7) and at the same time, the powdered matter (7) is agitated by vibrating the container (6). When the container (6) is heated, moisture set to be a binder for mutually bonding the powdered matter (7) evaporates from the powdered matter (7). At the same time, when vibration is given to the powdered matter (7) by an oscillator (10), the powdered matter (7) is sufficiently agitated, the moisture is fully dried, at the same time, the vibration allows each powdered matter (7) to collide with one another, the aggregated powdered matter (7) is pulverized, and each powdered matter (7) is restored. COPYRIGHT: (C)2003,JPO
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