| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacturing method of a resin sealing package for more inexpensively manufacturing a small and thin semiconductor package by using a laminate that can be peeled at a barrier layer and using selection etching technology. SOLUTION: The laminate is constituted of a support member, the barrier layer, a conductor layer and an inner terminal. The laminate is constituted of the support member, the barrier layer which is formed adjacently to the support member and is formed of metal or an alloy functioning as an etching barrier with respect to Cu or a Cu alloy, the conductor layer formed of Cu or the Cu alloy which is formed adjacently to the barrier layer and the inner connection terminal which is partially formed adjacently to the conductor layer and is formed of metal or an alloy functioning as an etching mask with respect to the conductor layer. A weak bonding pat exists in the barrier layer. COPYRIGHT: (C)2003,JPO
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