发明名称 METHOD FOR FORMING SOLDER PATTERN AND MULTIPLE-PATTERN CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To reduce production cost even when circuit boards having different functions are present mixedly. SOLUTION: The multiple-pattern circuit board 1 comprises two ROM boards 2 and 3 having an identical circuit pattern except that the surface and rear surface are inverted and being mounted with a mask ROM, and the like, and two RAM boards 4 and 5 having an identical circuit pattern except that the surface and rear surface are inverted and being mounted with an SDRAM, and the like. One of the ROM boards 2 and 3 is arranged under such a state as the other is turned by 180°about the inversion axis Y<SB>0</SB>, and one of the RAM boards 4 and 5 is arranged under such a state as the other is turned by 180°about the inversion axis Y<SB>0</SB>. Consequently, the arranging state of each board is identical in detail on the surface side 1a and the rear surface 1b side of the multiple-pattern circuit board 1. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003229656(A) 申请公布日期 2003.08.15
申请号 JP20020027350 申请日期 2002.02.04
申请人 NEC ACCESS TECHNICA LTD 发明人 SUZUKI MASAYUKI
分类号 H05K3/34;H05K3/00;(IPC1-7):H05K3/34 主分类号 H05K3/34
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