发明名称 ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To sustain high reliability of wiring over a long period even when a flexible wiring board and a circuit board wired at a fine pitch are employed. SOLUTION: The method for manufacturing an electronic component comprises a step for coating a first substrate on which a first electrode is formed of press-fitting metal with thermosetting resin, a step for arranging a press-fitting conductive member in single layer on a flat plate, a step for pressing a second substrate on which a second electrode of press-fitting metal is formed to be paired with the first electrode against the flat plate such that the second electrode faces the press-fitting conductive member thus bringing the second electrode and the press-fitting conductive member into press-fitting, a step for pressing the second substrate where the press-fitting metal is pressed against the second electrode against the first substrate coated with thermosetting resin such that the first electrode faces the second electrode thus bringing the first electrode and the press-fitting conductive member into press fit, and a step for heating the first and second substrates under pressed state. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003229650(A) 申请公布日期 2003.08.15
申请号 JP20020028153 申请日期 2002.02.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISHIZAKI MITSUNORI;HAMAGUCHI TSUNEO;KITAMURA YOICHI
分类号 H05K1/14;H05K3/36;(IPC1-7):H05K1/14 主分类号 H05K1/14
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