| 摘要 |
PROBLEM TO BE SOLVED: To reduce noises to be radiated by a conducting pattern by decreasing the weight and thickness of a hybrid integrated circuit device and to enhance the precision of protection of a circuit against heating. SOLUTION: A second circuit device 40 is installed on backside of a first circuit device 30 with a first circuit element 32, such as a power element built therein. A control circuit, etc., for controlling the first circuit element 32, etc., are built in the second circuit device 40. In addition, a backside element 23 is installed on the backside of the first circuit device 30. On the first circuit device 30, a radiation plate 21 is provided where a resin only is exposed. COPYRIGHT: (C)2003,JPO |
