发明名称 ADHESIVE FILM FOR MULTILAYERED PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To eliminate the need of the presently indispensable desmearing step by means of a laser drilling machine at the time of manufacturing a build-up multilayered wiring board. SOLUTION: When an adhesive film for multilayered printed wiring board containing a polyvinyl butyral resin, epoxy resin, melamine resin, multifunctional acrylate, and electrical insulating filler as essential ingredients is used, the desmearing step becomes unnecessary, because no smear occurs during the course of laser drilling. The amount of the electrical insulating filler in the adhesive film is adjusted to 30-200 parts to the total solid content of 100 parts of the resins. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003229674(A) 申请公布日期 2003.08.15
申请号 JP20020025593 申请日期 2002.02.01
申请人 HITACHI CHEM CO LTD 发明人 TANAKA MASASHI;KUMAKURA YOSHITOSHI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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