| 摘要 |
PROBLEM TO BE SOLVED: To provide a environment-friendly nonhalogen based prepreg for printed wiring board exhibiting excellent flame retardance, Tg, and substrate solder heat resistance, and its use. SOLUTION: The glass basic material polyimide resin prepreg for printed wiring board is produced of thermosetting resin varnish not containing halogen element but containing (a) polyimide resin prepolymer, (b) aluminium hydroxide, and (c) organic silane having one or more functional group reacting on a hydroxy group at the terminal and having one or more aryl group of 6-12C as a hydrocarbon group. COPYRIGHT: (C)2003,JPO |
