| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has such a structure that bonding wires are electrically connected to electrode pads on the element side and has a superior workability in wire bonding of the bonding wires, and also to provide a method of manufacturing the same. <P>SOLUTION: A single metal plate 30 is bonded by a solder 50 to a plurality of emitter electrode pads 22a formed on the top face of the semiconductor element 10. The metal plate 30 links the plurality of electrode pads 22a across each section (non-bonding region) where a gate finger 26 or the like is formed. One end of each of a plurality of bonding wires 40 is connected to the top face of the metal plate 30. <P>COPYRIGHT: (C)2003,JPO |
| 申请公布号 |
JP2003229449(A) |
申请公布日期 |
2003.08.15 |
| 申请号 |
JP20020023940 |
申请日期 |
2002.01.31 |
| 申请人 |
TOYOTA MOTOR CORP |
发明人 |
HAMADA KIMIMORI;TAKATANI HIDESHI;TOSHIMA HIDEKI;FUKAMI TAKESHI;YAMAZOE MASAKAZU |
| 分类号 |
H01L21/60;H01L25/04;H01L25/18;H01L29/78 |
主分类号 |
H01L21/60 |
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