发明名称 COLLOIDAL SILICA FOR POLISHING
摘要 <p><P>PROBLEM TO BE SOLVED: To obtain a colloidal silica having improved polishing speed and produced by using a tetraalkoxysilane solution as a raw material. <P>SOLUTION: This colloidal silica for polishing is produced by adjusting the pH of a colloidal silica produced from a tetraalkoxysilane e.g. by hydrolysis to 7-11.5 by the addition of one or more kinds of alkaline substances selected from ammonia, an amine, quaternary ammonium hydroxide, sodium hydroxide, potassium hydroxide and lithium hydroxide to the colloidal silica and thermally aging the product at 50-300°C. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003226865(A) 申请公布日期 2003.08.15
申请号 JP20020025995 申请日期 2002.02.01
申请人 EKC TECHNOLOGY KK 发明人 NOJO HARUKI;YOSHIDA AKITOSHI
分类号 B24B57/02;B24B37/00;C09K3/14;H01L21/304;(IPC1-7):C09K3/14 主分类号 B24B57/02
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