| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for development capable of preventing the occurrence of development defects of a substrate or defects in a line thickness, form, etc. SOLUTION: A development device 20 develops the treated surface S of a wafer W. It comprises a first rotating/holding means 122 which rotatably holds a base 61 for film forming that is formed on the upper surface of a development liquid film A, a second rotating/holding means 129 which rotatably holds the wafer W by pointing the treated surface S to the development liquid film A, and a drive means 130 which raises/lowers/tilts the second rotating/ holding means 129 to make the wafer W contact the development liquid film A. The drive means 130 raises/lowers the wafer W held by the rotating/holding means 129 while tilting it around a virtual horizontal axis. COPYRIGHT: (C)2003,JPO |
