| 摘要 |
PROBLEM TO BE SOLVED: To prevent the characteristics of a semiconductor substrate from changing because of deformation of a resin case, related to a semiconductor pressure sensor where both rear and main surfaces of the semiconductor substrate, which output deformation under pressure difference between both sides of a diaphragm as an electric signal, are jointed to one end surface of a pedestal by the outer peripheral part, with the pedestal bonded to the resin case using an adhesive. SOLUTION: The pedestal is directly or indirectly bonded to the resin case so that a non-joint region to the resin case is formed on the other end surface of the pedestal opposed to one end surface of the pedestal bonded to the semiconductor substrate. Thus, even if the resin case is deformed under heat, or the like, the semiconductor substrate is not affected by it. COPYRIGHT: (C)2003,JPO
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