| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered glass ceramic wiring board that can be increased in strength even when a high dielectric layer is interposed between low dielectric layers and, in addition, has a high mounting reliability. SOLUTION: This multilayered glass ceramic wiring board is provided with conductor wiring layers on and/or in a laminated substrate constituted by interlayering the high dielectric layer having a specific inductive capacity of≥14, in the frequency region of 1 MHz to 3 GHz between the low dielectric layers composed of glass ceramic insulating layers having specific inductive capacities of≤9 in the same frequency region. The three-point bending strength of this multilayered wiring board in a 3-mm span is adjusted to≥300 MPa and the thicknesses tLK and tHK of the low and high dielectric layers are adjusted to meet the relation of tLK/tHK≥3. In addition, the number of pores having diameters of≥20μm existing in an area having a size of 100μm by 100μm in the cross-sectional mirror-finished photograph of the high dielectric layer is controlled to≤5. COPYRIGHT: (C)2003,JPO |
