| 摘要 |
PROBLEM TO BE SOLVED: To prevent warpages or damages of an extremely thin finished semiconductor wafer as reduction in the mechanical strength of the extremely thin finished semiconductor wafer can be suppressed by a lattice-shaped rib, and to manufacture an extremely thin semiconductor chip by dicing a scribe line and the rib as a chip of the extremely thin finished semiconductor wafer is thin in thickness. SOLUTION: A surface 28 to be ground of a thin finished semiconductor wafer 27 is dry-etched by using a mask 29 composed of a resist, and a rib 30 is formed corresponding to a scribe line 24 by leaving the thickness of a substrate 20 behind, and a cavity 31 corresponding to a chip 23 is recessed so as to encircle the cavity with the rib 30. At a dicing step, the scribing line 24 of an extremely thin finished semiconductor wafer 33 is cut off by a diamond blade 38 to cut off the rib 30 to segmentalize the extremely thin semiconductor chip 39. COPYRIGHT: (C)2003,JPO
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