发明名称 BLACK COMPOSITE PARTICLE POWDER FOR LIQUID SEMICONDUCTOR SEALANT AND LIQUID SEMICONDUCTOR SEALANT
摘要 PROBLEM TO BE SOLVED: To provide black composite particle powder which has high black color degree, flowability and colorability, has excellent dispersibility in a binder resin, and is used for liquid semiconductor sealants, and to obtain a liquid semiconductor sealant which has a low viscosity, a high volume resistivity value, an excellent black color degree, excellent moisture resistance and an excellent flexural strength. SOLUTION: The black composite particle powder which is used for the liquid semiconductor sealants and comprises black composite particle powder prepared by coating the surfaces of extender pigment particles with a paste and then adhering carbon black to the coating and having an average particle diameter of 1.0 to 30.0μm is characterized in that the amount of the adhered carbon black is 1 to 100 pts.wt. per 100 pts.wt. of the extender pigment. The liquid semiconductor sealant comprises a binder resin and the black composite particle powder used for the liquid semiconductor sealants. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003226823(A) 申请公布日期 2003.08.15
申请号 JP20020030332 申请日期 2002.02.07
申请人 TODA KOGYO CORP 发明人 MORII HIROKO;SHIMOHATA YUSUKE
分类号 C09K3/10;C09C1/56;C09C3/12;H01L23/29;H01L23/31;(IPC1-7):C09C1/56 主分类号 C09K3/10
代理机构 代理人
主权项
地址