发明名称 FILM DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a film deposition apparatus which can reliably fix a target to a backing plate while permitting the expansion thereof, and prevent the target from being melted and broken during the sputtering. SOLUTION: A back side of a disk-like target 10 is abutted on the backing plate 22. A thin plate part 10a on the outer circumference of the target 10 is pressed by a pressing member 26 while interposing a slip member 27 therebetween, and fixed to the backing plate 22 by a fixing screw 26a. Even when the target 10 is expanded by the heat during the sputtering, the slip between the thin plate part 10a and the slip member 26 permits the expansion, and no warpage is caused in the target 10. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003226967(A) 申请公布日期 2003.08.15
申请号 JP20020028112 申请日期 2002.02.05
申请人 SHIBAURA MECHATRONICS CORP 发明人 OTSUKA HIROSHI;TAKEUCHI HACHIYA
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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