| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate incorporating element which can easily form a circuit pattern without the need of a complicated process and which does not need highly precise parts mounting, and to provide the manufacturing method. SOLUTION: A solid foil layer 55A of a wiring conductor is stuck to the surface of an insulating base material 51 having a void 52 for storing a semiconductor element 56, and the semiconductor element 56 is electrically bonded to the rear face of the solid foil layer 55. The solid foil layer 55A is patterned into a prescribed circuit pattern and a wiring layer 55 is formed. The fine circuit pattern 55 is appropriately formed without the need of the highly precise mounting process of the semiconductor element 56, a manufacture process is simplified and cost is reduced. COPYRIGHT: (C)2003,JPO |
