| 摘要 |
PROBLEM TO BE SOLVED: To provide multilayered wiring that can be increased easily in density and is high in reliability. SOLUTION: In a method of manufacturing multilayered wiring board, an interlayer insulating film 4 is formed on a first wiring layer 3 formed on a substrate and, after a contact hole 9 is formed in the insulating film 4, the whole surface of the substrate is coated with conductive films 5 and 6. Then the surface of the substrate is flattened by electroplating a film 7 on the conductive film 6 so that the film 7 may become thicker in thickness in the recessed section composed of the contact hole 9 by using the conductive films 5 and 6 as electrodes. After the surface is flattened, a second wiring layer 8 is formed so that the layer 8 may come into contact with the plated film 7. COPYRIGHT: (C)2003,JPO |
