| 摘要 |
PROBLEM TO BE SOLVED: To provide an extremely useful high heat dissipation insulating substrate in which solder crack resistance is realized while keeping high heat dissipation, and a module using it. SOLUTION: Related to a metal base substrate provided by laminating an insulating layer on a metal plate, and further putting a conductor circuit on the insulating layer, the insulating layer is a high heat dissipation insulating layer of a heat conductivity not lower than 3.0 W/mK. Further, tensile storage modulus of the insulating layer at 398 K is 1000 MPa or lower. COPYRIGHT: (C)2003,JPO
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