| 摘要 |
PROBLEM TO BE SOLVED: To remove particles which adhere to a surface. SOLUTION: In a semiconductor wafer 1 formed in nearly a disk shape, a surface 2 has a flat main surface 3 and a surface-side beveling section 4 formed at a periphery section, and a back 6 has a flat main surface 7 and a back-side beveling section 8 formed at the peripheral section. A width A1 in a direction toward the inside of a wafer radial direction from a circumferential end 9 at the surface-side beveling section 4 is set narrower than a width A2 in the direction toward the inside of the wafer radial direction from the circumferential end 9 at the back-side beveling section 8. COPYRIGHT: (C)2003,JPO
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