| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method of bonding an electronic component which is capable of accurately bonding electrodes of the electronic component to those of a substrate by making an ultrasonic bonding tool following a subtle tilt of the substrate which is different at each mounting point of the electronic component, flexibly in response to the subtle tilt. SOLUTION: With the US bonding tool 74 being US-vibrated by means of an US vibrator 77, a bump 6a of the electronic component 6 is bonded to the substrate 5. The US bonding tool 74 is designed to make a tilting (turning) operation by a follower mechanism, and so the bonding can be performed, with the US bonding tool 74 following the tilt of the substrate 5 which is subtly different at each mounting point of the electronic component 6. COPYRIGHT: (C)2003,JPO
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