| 摘要 |
PROBLEM TO BE SOLVED: To provide a probing apparatus with a polishing mechanism and a method of polishing thereby which is capable of increasing a test reliability by surely removing contaminations by polishing, while extending the service life of an expensive probe pin by preventing excessive polishing, and which can also prevent an IC element from being contaminated by the removed contaminations. SOLUTION: The probing apparatus with a polishing mechanism comprises a polishing section 7 for removing the contaminations deposited on the probe pin 5, a gas supplying section 8 disposed above the polishing section 7, an upper cup 9 which is connected to the gas supplying section 8 and has such a shape as to cover the polishing section 7, a gas exhaust section 10 disposed below the polishing section 7, a lower cup 11 which is connected to the gas exhaust section 10 and has such a shape as to cover the polishing section 7, a contaminations detecting section 12 disposed between the gas exhaust section 10 and the lower cup 11 to detect contaminations contained in a gas, and a polishing control section 13 for determining to continue or finish polishing based on data from the contaminations detecting section 12. COPYRIGHT: (C)2003,JPO
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