| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-destructive inspection method for inspecting junction strength on the junction interface between a base material and a thin film without destroying the thin film. SOLUTION: In a member where a thin film 2 is joined, a transmitter probe 4 is arranged on the surface of a base material 1 and at the same time, a receiving probe 5 is arranged on the surface of the thin film 2. Ultrasonic waves whose frequency is continuously changed at a fixed amplitude are transmitted from the transmitter probe 4. Ultrasonic waves through a junction interface 3 are received by the receiving probe 5. The frequency analysis of the received ultrasonic waves is made to obtain a frequency whose amplitude greatly decreases in the non-destructive inspection method of thin-film junction strength for inspecting the strength of the junction interface 3. COPYRIGHT: (C)2003,JPO
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