| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide curing thick film resistance paste capable of forming a thick film resistor having a small temperature coefficient by heating and curing at a comparatively low temperature. <P>SOLUTION: This thick film resistance paste is manufactured by kneading 10-50 wt.% resin, 5-90 wt.% conductive metal oxide and 0.1-85 wt.% insulating component. <P>COPYRIGHT: (C)2003,JPO</p> |
