发明名称 Semiconductor device having dual-gate structure and method of manufacturing the same
摘要 By forming a doped polysilicon layer (PS2) containing boron through the CVD method in a material gas including a compound containing boron such as BCl3 (boron trichloride), an opening left after removing a gate electrode (11) in a region (PR) is filled with the doped polysilicon layer (PS2). In the doped polysilicon layer (PS2), boron atoms are uniformly distributed with high activation rate. Thus provided is a method of manufacturing a semiconductor device, which is capable of suppressing depletion of a gate electrode of a P-channel MOS transistor and suppressing penetration of impurity in a CMOS transistor of dual-gate structure.
申请公布号 US2003151098(A1) 申请公布日期 2003.08.14
申请号 US20020214593 申请日期 2002.08.09
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 NISHIDA YUKIO;HORITA KATSUYUKI
分类号 H01L21/28;H01L21/336;H01L21/768;H01L21/8238;H01L27/092;(IPC1-7):H01L29/76;H01L31/062 主分类号 H01L21/28
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