发明名称 |
Semiconductor device having dual-gate structure and method of manufacturing the same |
摘要 |
By forming a doped polysilicon layer (PS2) containing boron through the CVD method in a material gas including a compound containing boron such as BCl3 (boron trichloride), an opening left after removing a gate electrode (11) in a region (PR) is filled with the doped polysilicon layer (PS2). In the doped polysilicon layer (PS2), boron atoms are uniformly distributed with high activation rate. Thus provided is a method of manufacturing a semiconductor device, which is capable of suppressing depletion of a gate electrode of a P-channel MOS transistor and suppressing penetration of impurity in a CMOS transistor of dual-gate structure.
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申请公布号 |
US2003151098(A1) |
申请公布日期 |
2003.08.14 |
申请号 |
US20020214593 |
申请日期 |
2002.08.09 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NISHIDA YUKIO;HORITA KATSUYUKI |
分类号 |
H01L21/28;H01L21/336;H01L21/768;H01L21/8238;H01L27/092;(IPC1-7):H01L29/76;H01L31/062 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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