SYSTEM AND METHOD FOR ACTIVE CONTROL OF SPACER DEPOSITION

摘要

A system for regulating spacer deposition is provided. At least one spacer deposition component deposits spacer on a portion of a wafer. A spacer deposition controller regulates the at least one spacer deposition component. A system for directing light directs light to the at least one spacer and collects light reflected from the portion of the wafer. A measuring system measures thickness parameters associated with the deposited spacer. A processor is operatively coupled to the measuring system and the spacer deposition controller, wherein the processor receives the measured data from the measuring system, analyzes the measured data by comparing the measured data to stored acceptable spacer thickness values to determine necessary adjustments to the spacer deposition component via the spacer deposition controller to facilitate regulating spacer thickness on the portion of the wafer and on subsequent portions of wafers.