发明名称 Mask film, its manufacturing method, and manufacturing method of circuit board using the same
摘要 A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.
申请公布号 US2003153197(A1) 申请公布日期 2003.08.14
申请号 US20030338642 申请日期 2003.01.09
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TAKENAKA TOSHIAKI;KONDO TOSHIKAZU;KISHIMOTO KUNIO;NAKAMURA SHINJI;ECHIGO FUMIO
分类号 B23K26/00;B23K26/38;H05K3/00;H05K3/40;(IPC1-7):H01L21/302;H01L21/461 主分类号 B23K26/00
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