发明名称 EDGE EXPOSURE WAFER SYSTEM OF FORCIBLE COOLING TYPE
摘要 PURPOSE: An edge exposure wafer system of a forcible cooling type is provided to control the heat of a lamp itself and extend the lifetime of the lamp by completely eliminating the heat of the edge exposure wafer system itself. CONSTITUTION: A wafer is placed on a chuck(11). A light source(19) is so installed to perform an exposure process on the edge of the wafer. A temperature sensor(27) detects a temperature. An exhaust pipe(23) exhausts the heat. A convection-type ventilator(25) is installed in the exhaust pipe to forcibly exhaust the air inside the edge exposure wafer system to the outside.
申请公布号 KR20030066985(A) 申请公布日期 2003.08.14
申请号 KR20020006768 申请日期 2002.02.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOO, YEONG JIN
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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