| 发明名称 |
PAPERBOARD SUBSTRATE FOR BLISTER PACKAGING |
| 摘要 |
<p>A packaging laminate comprising a paperboard substrate for providing a base layer, a tear-resistant polymer layer applied to said substrate, and a heat seal polymer layer applied to said tear-resistant polymer. This laminate structure is particularly useful for blister pack packaging.</p> |
| 申请公布号 |
CA2474745(A1) |
申请公布日期 |
2003.08.14 |
| 申请号 |
CA20032474745 |
申请日期 |
2003.01.31 |
| 申请人 |
INTERNATIONAL PAPER COMPANY |
发明人 |
REED, DAVID;HOLBERT, VICTOR P. |
| 分类号 |
B65D65/40;A61J1/03;B32B7/10;B32B27/00;B32B27/08;B32B27/10;B32B27/34;B32B27/36;B32B27/40;(IPC1-7):B32B3/26;B65D75/36;A61B19/02 |
主分类号 |
B65D65/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
