BUMP CHIP CARRIER PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A bump chip carrier package is provided to reduce the size of a package and decrease the thickness of the package by electrically connecting a semiconductor chip with a bump terminal through a bump bonding method. CONSTITUTION: Bonding pads(22) are disposed as a frame type on the edge of the lower surface of the semiconductor chip(21). Conductive bumps(23) are attached to the upper surface of each bonding pad. Several bump pads(31) are entirely disposed as a frame type, having a concave groove of the first depth and disposed under each bump. Several bump terminals(32) are connected to each bump pad and a metal interconnection(33) by a one-to-one correspondence, having a concave groove of the second depth deeper than the first depth at both sides of the bump pad and entirely disposed as a frame type. Encapsulant(40) encapsulates the upper surface of the bump terminal including a connection part between the semiconductor chip and the bump pad.