RESIN COMPOSITION

摘要

A resin composition excellent in mechanical properties, dimensional stability, heat resistance, flame retardancy, etc., especially in high-temperature properties, material for substrates, sheet, laminate, copper foil with a resin, copper-clad laminate, tape for TAB, printed wiring board, prepreg, and adhesive sheet. The resin composition comprises 100 parts by weight of a thermoplastic resin and 0.1 to 65 parts by weight of an inorganic compound, and has an average coefficient of linear expansion (alpha2) of 1.0x10-3 [°C-1] or lower in the temperature range of from the temperature higher by 10°C than the glass transition temperature of the resin composition to that higher by 50°C than the glass transition temperature.