发明名称 Dispersion for chemical mechanical polishing
摘要 An aqueous dispersion is used in the chemical mechanical polishing of surfaces, particularly oxidic surfaces, such as silicon dioxide. The aqueous dispersion contains a powder of pyrogenically produced silicon dioxide doped with 0.01 and 3 wt. % aluminium oxide, relative to the total amount of powder, said powder having an average particle diameter in the dispersion of not more than 0.1 mum.
申请公布号 US2003150838(A1) 申请公布日期 2003.08.14
申请号 US20030354969 申请日期 2003.01.31
申请人 DEGUSSA AG 发明人 LORTZ WOLFGANG;BATZ-SOHN CHRISTOPH;PERLET GABRIELE;WILL WERNER
分类号 B24B37/00;C01B33/18;C09G1/02;C09K3/14;H01L21/304;H01L21/3105;(IPC1-7):H01L21/461;C03C25/68 主分类号 B24B37/00
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