Wire bonder calibration method for semiconductor chips, involves setting controlling parameters of ultrasonic transducer corresponding to two different capillaries, to satisfy specific condition with respect to strength of capillaries

摘要

The ultrasonic waves are applied to a capillary (10) clamped onto the tip of a horn (16), from an ultrasonic transducer (17). The controlling parameters (P1,P2) of the transducer with respect to two different capillaries, are set, such that a condition P2 = g(k1,k2)xP1, is satisfied, where g(k1,k2) is a predetermined function of the flexural strength values (k1,k2) of the two capillaries.