发明名称 Chip clamshell packaging
摘要 A protective plastic package for storage, transportation and display of electronic components, particularly integrated circuits. The package has a top and bottom cover, is slightly larger than the electronic component, and centers the electronic component within it to prevent damage. The package is also has anti-static properties to prevent static electricity damage. The electronic component is retained within the package when open, and may be ejected from the package without touching the electronic component. The protective plastic package may also be used within larger display packaging to provide an added level of protection against damage and theft. If individualized identification tags are placed on individual items within transparent display packaging, they can be individually read without opening the package or placing corresponding tags on the package exterior.
申请公布号 US2003150770(A1) 申请公布日期 2003.08.14
申请号 US20020075941 申请日期 2002.02.13
申请人 BERKLEY INDUSTRIES LLC 发明人 CAMPBELL JOE;KANIEWSKI JON L.;MILBURN STEVEN A.;TOMA JOSEPH G.
分类号 B65D43/16;B65D77/04;B65D85/86;H05K13/00;(IPC1-7):B65D85/30;B65D85/48 主分类号 B65D43/16
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