| 摘要 |
The object of the present invention is to solve problems on a substrate treatment time when using an SLS method or continuous-oscillation laser by using a software technique. It is possible to shorten a substrate treatment time by using a laser-system control program for making a computer function as the following means; means for a person to input the information on CAD masks for forming a silicon island, a contact, and wiring metal on a substrate, means for automatically extracting the positional information for forming the silicon island on the substrate, formal information on the silicon island, and directional information on the source, channel, and drain of the silicon island in accordance with the input information on CAD masks of the silicon island, a contact, and wiring metal, means for obtaining an optimum driving condition of a laser system in accordance with the extracted positional information on the silicon island, formal information on the silicon island, and directional information on the source, channel, and drain of the silicon island, and means for controlling the laser system in accordance with the optimum driving condition of the laser system.
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