发明名称 |
Methods for making a paste of materials to form bumps for screen print processes |
摘要 |
Methods of making a paste of materials used in forming bumps for semiconductor applications wherein the distribution of trace elements is substantially uniform are provided. The methods of making a paste for a semiconductor package process comprises heating and fusing several materials to alloy the materials, rapidly cooling the fused alloy composition to improve conformity of the composition, processing the cooled alloy composition into a fine powder, and processing the alloy powder to be a paste-shape. |
申请公布号 |
US2003153174(A1) |
申请公布日期 |
2003.08.14 |
申请号 |
US20030346280 |
申请日期 |
2003.01.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YI SANG-DON |
分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|