| 摘要 |
<p>A polishing system (20) can have a rotatable platen (24), a polishing pad (30) secured to the platen, a carrier head (10) to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.</p> |
