CONDUCTIVE BONDING TAPE AND METHOD FOR MOUNTING SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A method for mounting a semiconductor package using conductive bonding tape is provided to prevent environmental pollution caused by a lead component by simplifying a semiconductor assembly process and eliminating the necessity of solder when the package is attached to a printed circuit board. CONSTITUTION: A semiconductor package using a leadframe completed through the semiconductor assembly process is mounted on a substrate. Conductive bonding tape(30) is attached to the ends of a plurality of leads exposed to the outside of the semiconductor package. The semiconductor package is attached to the printed circuit board by the conductive bonding tape.